To make it clear from the beginning: this is a (possibly) destructive method of reading ROM chips. The process of extracting and possibly a resoldering of the memory chip might fail. In my case I’ve tested it on two Sharp CE-150 PCBs I’ve declared to be spare parts. It is only a proof of concept as there are simpler non-destructive ways of ROM extraction on a Sharp PC. I was just curious and so I’m describing my experiences.
Well… At first I did not want to desolder the ROMs: I started with the intention to use a set of probes attached to the individual pins of the chip to read the content of the Sharp PC / CE ROM chips. This did not work due to the narrow leg distance of the QFP chips (0.8 mm).
Desoldering QFP chips can be done rather quickly with a hot air gun. At least that’s the most comfortable way I know of. I usually add some flux and in some cases larger quantities of leaded solder. The latter decreases the melting point and speeds up the process. I don’t care about solder joints as the chips and the pads can easily be cleaned after the removal. Excessive amounts of solder can be removed with flux and a clean soldering iron tip.
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